MediaTek’s new Dimensity 9000 flagship could compete with Qualcomm’s top-tier Snapdragon chips

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The new flagship processor from the company, the Dimensity 9000, looks like it should be able to go head to head with the best chips that more popular competitors like Qualcomm and SAMSUNG offer.

The new Dimensity 9000 is the most powerful of the top-tier chips and will make a case for a flagship device in the future.

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The first mobile chip to be built on TSMC's 4nm process is the Dimensity 9000. It is the first announcement that a single performance core with a 3.05 GHz clock speed is used in Arm's new core designs. The company says that its fifth-generation APU with six total cores for AI processing offers four times the performance and power efficiency compared to its previous generation.

The first processor for a phone.

The new Imagiq Gen 7 ISP is capable of transferring data at 9 gigapixels per second and is the world's first chip to be capable of capturing a 320-megapixel image.

The Dimensity 9000 has an onboard 5G modem with support for the 3GPP Release 16 specification. The new chip only offers built-in sub 6 GHz 5G support, without the fastermmWave standard. The Dimensity 9000 is the first phone to support both wi-fi 6E and the new 5.3 version of the Bluetooth wireless protocol.

It is likely that there will be more than one company that uses the latest Arm technologies, and it is likely that this will happen at the annual Snapdragon Tech Summit on November 30th. Even if the Dimensity 9000 is merely in the same weight class as whatever Qualcomm announces this year, that is a big win for MediaTek, which has largely lag behind until now.

The Dimensity 9000 shows that the company is finally looking to compete, even though it has been an also-ran for a long time. The question is whether phone manufacturers will join it.