Wayne Ma, The Information, shared alleged details today about future Apple silicon chip designs that will replace the first-generation M1, M1 Pro and M1 Max chips. These chips are manufactured using the 5nm process of Apple's chipmaking partner TSMC.
According to the report, Apple and TSMC will manufacture second-generation Apple silicon chip using an enhanced version TSMC's 5nm process. The chips will also contain two dies that can accommodate more cores. According to the report, these chips will be used in the next MacBook Pro models as well as other Mac desktops.
Apple plans to make a "much larger leap" with its third generation chips. Some of them will be made with TSMC’s 3nm process, and some may have four dies. This could result in the chips having as many as 40 compute cores. The M1 chip is equipped with an 8-core CPU, while the M1 Pro, M1 Max and M1 Max chips are equipped with 10-core CPUs. Apple's Mac Pro tower, on the other hand, can be outfitted with a 28-core Intel Xeon W CPU.
Sources tell the report that TSMC will be able to produce 3nm chips reliably by 2023, for both Macs as well as iPhones. According to the report, the third-generation chips will be codenamed Ibiza and Lobos and Palma. They are likely to debut first in higher-end Macs, such as future MacBook Pro models that measure 14 and 16 inches. Another third-generation chip of less power is being planned for the future MacBook Air.
The report claims that the next Mac Pro will be using a M1 Max chip with at most two dies as part of the first generation Apple silicon chips.
