Samsung 3nm wafer photo

The production of 3-nanometer chips by Apple's supplier, TSMC, has been beaten by the production of 3-nanometer chips bySamsung. The most advanced chips in the world are expected to be released by the end of the year.

These gains are achieved using a process called Gate-All- Around transistor architecture, an update on finFET, on a surface that has a smaller surface area than before. The process will be used for high performance, low power computing with mobile processors coming later, and that it will reduce power consumption by 50% and improve performance by 30%.

Samsung GAAFET chart

Being the first to enter the market is a good sign for the company. TSMC, the Taiwanese chipmaker that dominates market share and manufactures the chips for Apple's iPhones, iPads, MacBooks, and Macs, as well as supplies wafers to other companies, has a long road ahead of it. Half of the global foundry business is accounted for by TSMC.

In order to achieve maturity of technology, we will continue to innovate and build processes that help.

The production of 3nm chips won't have much of an effect on TSMC in the next year, according to a report. Before companies will call for its chips, the company needs to show that it can produce with the same cost efficiency as its rival.

Two mega tech firms waiting for mass production of 3nm chips that could improve the performance of existing products while enabling new technologies are competing for multi-year deals with Apple andQUALCOMM. The chips will be manufactured in South Korea at the Hwaseong facility. The company is building a plant in Texas that will cost more than 10 billion dollars to build.

With TSMC set to start high-volume production of 2nm technology in 25 years, it's going to be hard for the South Korean company to catch up.