The leaked specifications of the upcoming Intel Lake-HX mobile processors give us some insight as to what kind of performance we can expect from the new CPUs.

The first laptop platform with 16 cores will be made by Intel, and it will be in some of the best laptops on the market.

Intel Alder Lake-HX specifications.
VideoCardz

The Intel Vision event will take place from May 10 to May 11. Two Core i9 and three Core i7 are shown in the leaked specifications. The top of the lineup will find their way into enthusiast laptops and workstations.

The Core i9-12950HX has 16 cores and 24 threads, eight of which are P-cores, and eight of which are E-cores. We've seen it benchmarked as early as March 2022, but the tests may not be accurate when it's released.

The first mobile platform to offer 16 cores isAlder Lake-HX. The processor has clock speeds of 2.3 GHz and 5.0 GHz on its performance cores, as well as 30MB of L3 cache, according to the leak. The base power of the processor is 55 watt, but the max power goes up to 157 watt.

The Core i9-12900HX is an Intel vPro eligible processor, but the Core i9-12950HX is not. The fact that these are likely aimed at mobile workstations is the reason for this.

The Intel Core i9-12950HX has the same base power and max power as the rest of the lineup. The boost power of Intel's previous mobility platform was 42 watt.

The first mobile platform to support the new generation of PCIe Gen 5.0 is going to be the Alder Lake-HX. The number of lanes has increased considerably, with a total of 48 lanes compared to the 28 offered by Intel.

Intel Alder Lake mobility chip.
Intel

The Alder Lake-HX supports both Intel XMP 3.0 profiles andDDR5 memory. It has a feature called Dynamic Memory boost. It is expected that the CPUs will offer outstanding overclocking capabilities. The Intel Speed Optimizer will get an update, and the CPUs will come with Intel's Extreme Tuning Utility technology. All of the HX processors will be overclock-friendly according to Intel.

According to VideoCardz, which is where today's leak comes from, Intel is going to put the full Alder Lake Silicon on a BGA package, and the package will be the same size as its LGA desktop counterpart. In order to fit inside a much smaller space, it will be slimmed down to 2.0mm in height.

This isn't the first glimpse of the Alder Lake-HX specifications we have had so far. There is a high chance that the specifications we are seeing here are the real thing, and all we have to do is get an official confirmation from Intel.

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